NCSP 1616

            Size : 1.6*1.6*0.9mm

             

            Features:

            • Package Miniaturization

            • NCSP package technology

            • High heat resistance EMC packaging

            • Big welding plate design, Strengthen the weldability

            • With silicone molding technology to reduce internal

               stress and improve reliability

            • Specification
            • Test report
            • Application Manual
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